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cod. SAWBTFO811H
The soldering tacky flux, BTFO-81-1 ROL0 (WEE/RoHS conformant)
Type 1.2.3.1 acc. UNE-EN ISO 9454:2016 // ROL0 acc. DIN EN 61190-1-1 , has been specially developed for repair soldering, reflow applications and direct chip attach applications, and is suitable for dip tinning as well as special applications. BTFO-81-1 is characterized by enhanced wetting and spreading properties. Application takes place via a dosing syringe with a metallic tip. This enables an accurate dosing and positioning of the flux. The processing of the soldering tacky flux can be done with the aid of hot air or soldering irons. The residue left is clear, non-corrosive and non-conductive so there is no need to remove it, but it can be easily cleaned with isopropanol, solvent, or semi-aqueous systems. BTFO-81-1 is compatible with both leaded and lead-free applications. CUSTOMER ADDED VALUE: n Very good soldering properties (capillarity, wetting). n Broad process window. n Exact dosage. n VOC-free. n Clear, non-conductive, non-corrosive post-process residue.
